Wave Solder

The type of material used in the wave solder process has to withstand very extreme conditions that is why only glass reinforced resin composites are used. These are normally produced from 8mm thick composite sheet being extremely tough, chemically resistant and E.S.D. safe.

Presspahn has successfully tested the new range of materials available for use with a lead-free solder process. These materials have been specifically designed to cope with the higher temperatures required of this process.

Pallets can be machined in such a way as to leave “masked” areas on the underside which can preclude the need for masking tape and dots. They can also be supplied with a range of PCB fixing devices, the most common of which is the spring loaded Turnbuckle type although any custom design can be made.

No job is too big or too small, too simple or too complicated.

Contact us to find the right Solution for you